Intel W890 Platform Leaks: 350W TDP, 112 PCIe Lanes and Major Advancements for Next-Gen Workstations

350W TDP for Extreme Workloads

According to the leaked documents, the W890 platform supports CPUs with a massive 350W TDP, confirming that Intel is targeting heavy multi-core performance and sustained high-frequency operation. This power envelope suggests next-generation Xeon workstation processors capable of delivering major gains in rendering, simulation, AI workflows, and demanding productivity tasks.

112 PCIe Lanes — A Huge Expansion

One of the biggest highlights is support for up to 112 PCIe lanes, giving workstation builders enormous flexibility. This increase allows for:

• Multiple high-bandwidth GPUs
• Large NVMe storage arrays
• Professional accelerator cards
• Additional high-speed I/O options

For professionals relying on multiple GPUs or specialized PCIe cards, the W890 platform brings a level of expandability typically found only in server-class solutions.

Advanced Connectivity and Platform Improvements

The leaked specs also indicate broader improvements to the platform’s connectivity ecosystem. Users can expect upgraded PCIe generations, stronger multi-GPU support, enhanced memory channels, and better stability for long-duration workloads — all critical features for high-end workstation environments.

What This Means for Workstation Users

If these leaks are accurate, the Intel W890 platform is shaping up to be a substantial upgrade for professionals who need maximum performance and configurability. With significantly higher TDP limits and industry-leading PCIe lane counts, Intel is preparing a platform that can handle next-generation GPUs, accelerators, and storage solutions without compromise.

As more details emerge ahead of Intel’s official announcement, the W890 is quickly becoming one of the most anticipated workstation platforms in recent years.